Bond Data: US40434LAM72

HP INC 4.75% 2028

Pricing
Date 2025-02-21
Duration 2.73
Price 100.05
Yield to maturity 4.79
Reference
Asset class bond
Country United States of America
Coupon 4.75
Currency USD
FIGI BBG017ZH7RG3
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US40434LAM72
Issued amount 900,000,000.00
Issuer name HP INC
Issuer type corporate
Maturity date 2028-01-15
Name HP INC 4.75% 2028
Rank senior unsecured
Ticker HPQ 4.75 01/15/28
Price
Yield to Maturity (%)
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