| Pricing | |
|---|---|
| Date | 2025-02-21 |
| Duration | 3.19 |
| Price | 101.17 |
| Yield to maturity | 4.94 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 5.25 |
| Currency | USD |
| FIGI | BBG01HHNC5G0 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US422806AA75 |
| Issued amount | 600,000,000.00 |
| Issuer name | HEICO CORPORATION |
| Issuer type | corporate |
| Maturity date | 2028-08-01 |
| Name | HEICO CORPORATION 5.25% 2028 |
| Rank | senior unsecured |
| Ticker | HEI 5.25 08/01/28 |
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