Bond Data: US620076AH21

MOTOROLA SOLUTIONS INC 7.5% 2025

Pricing
Date 2025-01-08
Duration 0.35
Price 100.64
Yield to maturity 5.77
Reference
Asset class bond
Country United States of America
Coupon 7.50
Currency USD
FIGI BBG00001MSD6
Interest type fixed rate
Callable No
Outstanding Yes
Puttable No
ISIN US620076AH21
Issued amount 400,000,000.00
Issuer name MOTOROLA SOLUTIONS INC
Issuer type corporate
Maturity date 2025-05-15
Name MOTOROLA SOLUTIONS INC 7.5% 2025
Rank senior unsecured
Ticker MSI 7.5 05/15/25
Price
Yield to Maturity (%)
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