Bond Data: US620076AH21 | MOTOROLA SOLUTIONS INC 7.5% 2025
Pricing | |
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Date | 2025-04-03 |
Duration | 0.11 |
Price | 100.16 |
Yield to maturity | 6.16 |
Reference | |
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Asset class | bond |
Country | United States of America |
Coupon | 7.50 |
Currency | USD |
FIGI | BBG00001MSD6 |
Interest type | fixed rate |
Callable | No |
Outstanding | Yes |
Puttable | No |
ISIN | US620076AH21 |
Issued amount | 400,000,000.00 |
Issuer name | MOTOROLA SOLUTIONS INC |
Issuer type | corporate |
Maturity date | 2025-05-15 |
Name | MOTOROLA SOLUTIONS INC 7.5% 2025 |
Rank | senior unsecured |
Ticker | MSI 7.5 05/15/25 |
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