Bond Data: US620076AH21 | MOTOROLA SOLUTIONS INC 7.5% 2025
| Pricing | |
|---|---|
| Date | 2025-05-12 |
| Duration | 0.01 |
| Price | 99.96 |
| Yield to maturity | 12.79 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 7.500 |
| Currency | USD |
| FIGI | BBG00001MSD6 |
| Interest type | fixed rate |
| Callable | No |
| Outstanding | No |
| Puttable | No |
| ISIN | US620076AH21 |
| Issued amount | 400,000,000.00 |
| Issuer name | MOTOROLA SOLUTIONS INC |
| Issuer type | corporate |
| Maturity date | 2025-05-15 |
| Name | MOTOROLA SOLUTIONS INC 7.5% 2025 |
| Rank | senior unsecured |
| Ticker | MSI 7.5 05/15/25 |
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