Bond Data: US620076BF55 | MOTOROLA SOLUTIONS INC 4.0% 2024

Pricing
Date 2024-08-28
Duration 0.01
Price 99.78
Yield to maturity 25.60
Reference
Asset class Bond
Country United States of America
Coupon 4.000
Currency USD
FIGI BBG006YT6G12
Interest type Fixed rate
Callable Yes
Outstanding No
Puttable No
ISIN US620076BF55
Issued amount 600,000,000.00
Issuer name MOTOROLA SOLUTIONS INC
Issuer type Corporate
Maturity date 2024-09-01
Name MOTOROLA SOLUTIONS INC 4.0% 2024
Rank Senior unsecured
Ticker MSI 4 09/01/24
Price
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Yield to Maturity (%)
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