Bond Data: US620076BN89 | MOTOROLA SOLUTIONS INC 4.6% 2029
| Pricing | |
|---|---|
| Date | 2025-08-05 |
| Duration | 3.50 |
| Price | 100.74 |
| Yield to maturity | 4.44 |
| Reference | |
|---|---|
| Asset class | Bond |
| Country | United States of America |
| Coupon | 4.600 |
| Currency | USD |
| FIGI | BBG00P449F71 |
| Interest type | Fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US620076BN89 |
| Issued amount | 800,000,000.00 |
| Issuer name | MOTOROLA SOLUTIONS INC |
| Issuer type | Corporate |
| Maturity date | 2029-05-23 |
| Name | MOTOROLA SOLUTIONS INC 4.6% 2029 |
| Rank | Senior unsecured |
| Ticker | MSI 4.6 05/23/29 |
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