Bond Data: US747525AF05

QUALCOMM INCORPORATED 3.45% 2025

Pricing
Date 2025-01-30
Duration 0.30
Price 99.59
Yield to maturity 4.93
Reference
Asset class bond
Country United States of America
Coupon 3.45
Currency USD
FIGI BBG008P11QR4
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US747525AF05
Issued amount 2,000,000,000.00
Issuer name QUALCOMM INCORPORATED
Issuer type corporate
Maturity date 2025-05-20
Name QUALCOMM INCORPORATED 3.45% 2025
Rank senior unsecured
Ticker QCOM 3.45 05/20/25
Price
Yield to Maturity (%)
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