Bond Data: US747525AJ27 | QUALCOMM INCORPORATED 4.65% 2035
| Pricing | |
|---|---|
| Date | 2025-04-24 |
| Duration | 7.96 |
| Price | 97.41 |
| Yield to maturity | 5.04 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 4.650 |
| Currency | USD |
| FIGI | BBG008P11RP4 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US747525AJ27 |
| Issued amount | 1,000,000,000.00 |
| Issuer name | QUALCOMM INCORPORATED |
| Issuer type | corporate |
| Maturity date | 2035-05-20 |
| Name | QUALCOMM INCORPORATED 4.65% 2035 |
| Rank | senior unsecured |
| Ticker | QCOM 4.65 05/20/35 |
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