Bond Data: US747525AJ27

QUALCOMM INCORPORATED 4.65% 2035

Pricing
Date 2025-01-30
Duration 8.18
Price 96.79
Yield to maturity 5.12
Reference
Asset class bond
Country United States of America
Coupon 4.65
Currency USD
FIGI BBG008P11RP4
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US747525AJ27
Issued amount 1,000,000,000.00
Issuer name QUALCOMM INCORPORATED
Issuer type corporate
Maturity date 2035-05-20
Name QUALCOMM INCORPORATED 4.65% 2035
Rank senior unsecured
Ticker QCOM 4.65 05/20/35
Price
Yield to Maturity (%)
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