Bond Data: US747525AJ27 | QUALCOMM INCORPORATED 4.65% 2035
Pricing | |
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Date | 2025-04-03 |
Duration | 8.04 |
Price | 99.26 |
Yield to maturity | 4.80 |
Reference | |
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Asset class | bond |
Country | United States of America |
Coupon | 4.65 |
Currency | USD |
FIGI | BBG008P11RP4 |
Interest type | fixed rate |
Callable | Yes |
Outstanding | Yes |
Puttable | No |
ISIN | US747525AJ27 |
Issued amount | 1,000,000,000.00 |
Issuer name | QUALCOMM INCORPORATED |
Issuer type | corporate |
Maturity date | 2035-05-20 |
Name | QUALCOMM INCORPORATED 4.65% 2035 |
Rank | senior unsecured |
Ticker | QCOM 4.65 05/20/35 |
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