Bond Data: US747525AK99

QUALCOMM INCORPORATED 4.8% 2045

Pricing
Date 2025-02-21
Duration 12.61
Price 90.79
Yield to maturity 5.64
Reference
Asset class bond
Country United States of America
Coupon 4.80
Currency USD
FIGI BBG008P11RR2
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US747525AK99
Issued amount 1,500,000,000.00
Issuer name QUALCOMM INCORPORATED
Issuer type corporate
Maturity date 2045-05-20
Name QUALCOMM INCORPORATED 4.8% 2045
Rank senior unsecured
Ticker QCOM 4.8 05/20/45
Price
Yield to Maturity (%)
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