Bond Data: US747525AK99

QUALCOMM INCORPORATED 4.8% 2045

Pricing
date 2025-01-20
duration 12.62412
price 89.16
yield_to_maturity 5.79036
Reference
asset_class bond
country United States of America
coupon 4.8
currency USD
figi BBG008P11RR2
interest_type fixed rate
is_callable true
is_outstanding true
is_puttable false
isin US747525AK99
issued_amount 1.5e9
issuer_name QUALCOMM INCORPORATED
issuer_type corporate
maturity_date 2045-05-20
name QUALCOMM INCORPORATED 4.8% 2045
rank senior unsecured
ticker QCOM 4.8 05/20/45
Price
Yield to Maturity (%)
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