Bond Data: US747525AK99 | QUALCOMM INCORPORATED 4.8% 2045
| Pricing | |
|---|---|
| Date | 2025-04-24 |
| Duration | 12.36 |
| Price | 89.04 |
| Yield to maturity | 5.81 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 4.800 |
| Currency | USD |
| FIGI | BBG008P11RR2 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US747525AK99 |
| Issued amount | 1,500,000,000.00 |
| Issuer name | QUALCOMM INCORPORATED |
| Issuer type | corporate |
| Maturity date | 2045-05-20 |
| Name | QUALCOMM INCORPORATED 4.8% 2045 |
| Rank | senior unsecured |
| Ticker | QCOM 4.8 05/20/45 |
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