| Pricing | |
|---|---|
| Date | 2024-05-15 |
| Duration | 0.01 |
| Price | 99.77 |
| Yield to maturity | 21.52 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 2.90 |
| Currency | USD |
| FIGI | BBG00GQSK6P1 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | No |
| Puttable | No |
| ISIN | US747525AT09 |
| Issued amount | 1,500,000,000.00 |
| Issuer name | QUALCOMM INCORPORATED |
| Issuer type | corporate |
| Maturity date | 2024-05-20 |
| Name | QUALCOMM INCORPORATED 2.9% 2024 |
| Rank | senior unsecured |
| Ticker | QCOM 2.9 05/20/24 |
| Price |
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