Bond Data: US747525AU71 | QUALCOMM INCORPORATED 3.25% 2027
| Pricing | |
|---|---|
| Date | 2025-04-03 |
| Duration | 2.05 |
| Price | 98.45 |
| Yield to maturity | 4.06 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 3.25 |
| Currency | USD |
| FIGI | BBG00GQSK7Q8 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US747525AU71 |
| Issued amount | 2,000,000,000.00 |
| Issuer name | QUALCOMM INCORPORATED |
| Issuer type | corporate |
| Maturity date | 2027-05-20 |
| Name | QUALCOMM INCORPORATED 3.25% 2027 |
| Rank | senior unsecured |
| Ticker | QCOM 3.25 05/20/27 |
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