Bond Data: US747525AU71 | QUALCOMM INCORPORATED 3.25% 2027
Pricing | |
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Date | 2025-04-24 |
Duration | 1.99 |
Price | 97.96 |
Yield to maturity | 4.34 |
Reference | |
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Asset class | bond |
Country | United States of America |
Coupon | 3.250 |
Currency | USD |
FIGI | BBG00GQSK7Q8 |
Interest type | fixed rate |
Callable | Yes |
Outstanding | Yes |
Puttable | No |
ISIN | US747525AU71 |
Issued amount | 2,000,000,000.00 |
Issuer name | QUALCOMM INCORPORATED |
Issuer type | corporate |
Maturity date | 2027-05-20 |
Name | QUALCOMM INCORPORATED 3.25% 2027 |
Rank | senior unsecured |
Ticker | QCOM 3.25 05/20/27 |
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