Bond Data: US747525AU71

QUALCOMM INCORPORATED 3.25% 2027

Pricing
date 2025-01-20
duration 2.24725
price 97.21
yield_to_maturity 4.58506
Reference
asset_class bond
country United States of America
coupon 3.25
currency USD
figi BBG00GQSK7Q8
interest_type fixed rate
is_callable true
is_outstanding true
is_puttable false
isin US747525AU71
issued_amount 2.0e9
issuer_name QUALCOMM INCORPORATED
issuer_type corporate
maturity_date 2027-05-20
name QUALCOMM INCORPORATED 3.25% 2027
rank senior unsecured
ticker QCOM 3.25 05/20/27
Price
Yield to Maturity (%)
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