Bond Data: US747525AV54

QUALCOMM INCORPORATED 4.3% 2047

Pricing
date 2025-01-20
duration 13.55157
price 81.92
yield_to_maturity 5.83131
Reference
asset_class bond
country United States of America
coupon 4.3
currency USD
figi BBG00GQSK8L1
interest_type fixed rate
is_callable true
is_outstanding true
is_puttable false
isin US747525AV54
issued_amount 1.5e9
issuer_name QUALCOMM INCORPORATED
issuer_type corporate
maturity_date 2047-05-20
name QUALCOMM INCORPORATED 4.3% 2047
rank senior unsecured
ticker QCOM 4.3 05/20/47
Price
Yield to Maturity (%)
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