Bond Data: US747525AV54

QUALCOMM INCORPORATED 4.3% 2047

Pricing
Date 2025-02-21
Duration 13.55
Price 83.38
Yield to maturity 5.70
Reference
Asset class bond
Country United States of America
Coupon 4.30
Currency USD
FIGI BBG00GQSK8L1
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US747525AV54
Issued amount 1,500,000,000.00
Issuer name QUALCOMM INCORPORATED
Issuer type corporate
Maturity date 2047-05-20
Name QUALCOMM INCORPORATED 4.3% 2047
Rank senior unsecured
Ticker QCOM 4.3 05/20/47
Price
Yield to Maturity (%)
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