Bond Data: US747525BJ18 | QUALCOMM INCORPORATED 3.25% 2050
Pricing | |
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Date | 2025-04-24 |
Duration | 14.98 |
Price | 66.01 |
Yield to maturity | 5.94 |
Reference | |
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Asset class | bond |
Country | United States of America |
Coupon | 3.250 |
Currency | USD |
FIGI | BBG00TP84LM6 |
Interest type | fixed rate |
Callable | Yes |
Outstanding | Yes |
Puttable | No |
ISIN | US747525BJ18 |
Issued amount | 800,000,000.00 |
Issuer name | QUALCOMM INCORPORATED |
Issuer type | corporate |
Maturity date | 2050-05-20 |
Name | QUALCOMM INCORPORATED 3.25% 2050 |
Rank | senior unsecured |
Ticker | QCOM 3.25 05/20/50 |
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