Bond Data: US747525BJ18 | QUALCOMM INCORPORATED 3.25% 2050

Pricing
Date 2025-04-03
Duration 15.38
Price 70.15
Yield to maturity 5.52
Reference
Asset class bond
Country United States of America
Coupon 3.25
Currency USD
FIGI BBG00TP84LM6
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US747525BJ18
Issued amount 800,000,000.00
Issuer name QUALCOMM INCORPORATED
Issuer type corporate
Maturity date 2050-05-20
Name QUALCOMM INCORPORATED 3.25% 2050
Rank senior unsecured
Ticker QCOM 3.25 05/20/50
Price
Yield to Maturity (%)
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