Bond Data: US747525BK80

QUALCOMM INCORPORATED 2.15% 2030

Pricing
date 2025-01-08
duration 5.05197
price 87.353
yield_to_maturity 4.91928
Reference
asset_class bond
country United States of America
coupon 2.15
currency USD
figi BBG00TP84L91
interest_type fixed rate
is_callable true
is_outstanding true
is_puttable false
isin US747525BK80
issued_amount 1.2e9
issuer_name QUALCOMM INCORPORATED
issuer_type corporate
maturity_date 2030-05-20
name QUALCOMM INCORPORATED 2.15% 2030
rank senior unsecured
ticker QCOM 2.15 05/20/30
Price
Yield to Maturity (%)
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