Bond Data: US747525BN20

QUALCOMM INCORPORATED 1.3% 2028

Pricing
Date 2025-01-30
Duration 3.23
Price 89.00
Yield to maturity 5.01
Reference
Asset class bond
Country United States of America
Coupon 1.30
Currency USD
FIGI BBG00YB0VS51
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US747525BN20
Issued amount 952,411,000.00
Issuer name QUALCOMM INCORPORATED
Issuer type corporate
Maturity date 2028-05-20
Name QUALCOMM INCORPORATED 1.3% 2028
Rank senior unsecured
Ticker QCOM 1.3 05/20/28
Price
Yield to Maturity (%)
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