Bond Data: US747525BP77 | QUALCOMM INCORPORATED 1.65% 2032
| Pricing | |
|---|---|
| Date | 2025-04-03 |
| Duration | 6.65 |
| Price | 81.35 |
| Yield to maturity | 4.82 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 1.65 |
| Currency | USD |
| FIGI | BBG00YB0XSD0 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US747525BP77 |
| Issued amount | 1,234,132,000.00 |
| Issuer name | QUALCOMM INCORPORATED |
| Issuer type | corporate |
| Maturity date | 2032-05-20 |
| Name | QUALCOMM INCORPORATED 1.65% 2032 |
| Rank | senior unsecured |
| Ticker | QCOM 1.65 05/20/32 |
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