Bond Data: US747525BQ50

QUALCOMM INCORPORATED 4.25% 2032

Pricing
Date 2025-01-30
Duration 6.28
Price 96.00
Yield to maturity 4.97
Reference
Asset class bond
Country United States of America
Coupon 4.25
Currency USD
FIGI BBG0178JDWW3
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US747525BQ50
Issued amount 500,000,000.00
Issuer name QUALCOMM INCORPORATED
Issuer type corporate
Maturity date 2032-05-20
Name QUALCOMM INCORPORATED 4.25% 2032
Rank senior unsecured
Ticker QCOM 4.25 05/20/32
Price
Yield to Maturity (%)
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