Bond Data: US747525BS17

QUALCOMM INCORPORATED 5.4% 2033

Pricing
Date 2025-02-21
Duration 6.70
Price 103.21
Yield to maturity 4.99
Reference
Asset class bond
Country United States of America
Coupon 5.40
Currency USD
FIGI BBG01BFG0SJ0
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US747525BS17
Issued amount 700,000,000.00
Issuer name QUALCOMM INCORPORATED
Issuer type corporate
Maturity date 2033-05-20
Name QUALCOMM INCORPORATED 5.4% 2033
Rank senior unsecured
Ticker QCOM 5.4 05/20/33
Price
Yield to Maturity (%)
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