Bond Data: US747525BU62 | QUALCOMM INCORPORATED 4.5% 2030
| Pricing | |
|---|---|
| Date | 2025-05-28 |
| Duration | 4.51 |
| Price | 99.78 |
| Yield to maturity | 4.60 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 4.500 |
| Currency | USD |
| FIGI | BBG01V45CXP1 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US747525BU62 |
| Issued amount | 500,000,000.00 |
| Issuer name | QUALCOMM INCORPORATED |
| Issuer type | corporate |
| Maturity date | 2030-05-20 |
| Name | QUALCOMM INCORPORATED 4.5% 2030 |
| Rank | senior unsecured |
| Ticker | QCOM 4.5 05/20/30 |
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