QUALCOMM INCORPORATED 5.8% 2036 (US747525BZ59)
Reference and pricing data for corporate bonds · Bond CUSIP lookup
Reference
CUSIP
747525BZ5
Callable
Yes
Country
United States of America
Coupon
5.800
Currency
USD
FIGI
BBG026MH4XN0
ISIN
US747525BZ59
Interest type
Fixed rate
Issued amount
750,000,000.00
Issuer type
Corporate
Maturity date
2036-11-20
Outstanding
Yes
Puttable
No
Rank
Senior unsecured
Security type
Bond
Ticker
QCOM 5.8 11/20/36
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