QUALCOMM INCORPORATED 5.6% 2033 (US747525CB72)
Reference and pricing data for corporate bonds · Bond CUSIP lookup
Reference
CUSIP
747525CB7
Callable
Yes
Country
United States of America
Coupon
5.600
Currency
USD
FIGI
BBG026MH4TX8
ISIN
US747525CB72
Interest type
Fixed rate
Issued amount
750,000,000.00
Issuer type
Corporate
Maturity date
2033-11-20
Outstanding
Yes
Puttable
No
Rank
Senior unsecured
Security type
Bond
Ticker
QCOM 5.6 11/20/33
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