Bond Data: US87264ABU88 | TMOBILE USA INC 2.625% 2026
| Pricing | |
|---|---|
| Date | 2025-09-02 |
| Duration | 0.61 |
| Price | 98.89 |
| Yield to maturity | 4.53 |
| Reference | |
|---|---|
| Asset class | Bond |
| Country | United States of America |
| Coupon | 2.625 |
| Currency | USD |
| FIGI | BBG00ZNJPMM5 |
| Interest type | Fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US87264ABU88 |
| Issued amount | 1,200,000,000.00 |
| Issuer name | TMOBILE USA INC |
| Issuer type | Corporate |
| Maturity date | 2026-04-15 |
| Name | TMOBILE USA INC 2.625% 2026 |
| Rank | Senior unsecured |
| Ticker | TMUS 2.625 04/15/26 |
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