Bond Data: US87264ABX28 | TMOBILE USA INC 2.25% 2031
| Pricing | |
|---|---|
| Date | 2025-04-03 |
| Duration | 6.08 |
| Price | 85.12 |
| Yield to maturity | 4.97 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 2.25 |
| Currency | USD |
| FIGI | BBG010HF7DG3 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | No |
| Puttable | No |
| ISIN | US87264ABX28 |
| Issued amount | 992,400,000.00 |
| Issuer name | TMOBILE USA INC |
| Issuer type | corporate |
| Maturity date | 2031-11-15 |
| Name | TMOBILE USA INC 2.25% 2031 |
| Rank | secured |
| Ticker | TMUS 2.25 11/15/31 |
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