Bond Data: US87264ACY91 | TMOBILE USA INC 5.05% 2033
| Pricing | |
|---|---|
| Date | 2025-07-02 |
| Duration | 6.55 |
| Price | 100.28 |
| Yield to maturity | 5.07 |
| Reference | |
|---|---|
| Asset class | Bond |
| Country | United States of America |
| Coupon | 5.050 |
| Currency | USD |
| FIGI | BBG01F3MKMT1 |
| Interest type | Fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US87264ACY91 |
| Issued amount | 1,250,000,000.00 |
| Issuer name | TMOBILE USA INC |
| Issuer type | Corporate |
| Maturity date | 2033-07-15 |
| Name | TMOBILE USA INC 5.05% 2033 |
| Rank | Senior unsecured |
| Ticker | TMUS 5.05 07/15/33 |
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