Bond Data: US87264ADU60 | TMOBILE USA INC 5.875% 2055
| Pricing | |
|---|---|
| Date | 2025-04-24 |
| Duration | 13.86 |
| Price | 98.19 |
| Yield to maturity | 6.26 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 5.875 |
| Currency | USD |
| FIGI | BBG01T1YLC72 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US87264ADU60 |
| Issued amount | 1,250,000,000.00 |
| Issuer name | TMOBILE USA INC |
| Issuer type | corporate |
| Maturity date | 2055-11-15 |
| Name | TMOBILE USA INC 5.875% 2055 |
| Rank | senior unsecured |
| Ticker | TMUS 5.875 11/15/55 |
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