Bond Data: US879360AD71 | TELEDYNE TECHNOLOGIES INCORPORATED 2.25% 2028
Pricing | |
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Date | 2025-04-03 |
Duration | 2.91 |
Price | 93.29 |
Yield to maturity | 4.73 |
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Asset class | bond |
Country | United States of America |
Coupon | 2.25 |
Currency | USD |
FIGI | BBG00ZKWNC25 |
Interest type | fixed rate |
Callable | Yes |
Outstanding | Yes |
Puttable | No |
ISIN | US879360AD71 |
Issued amount | 700,000,000.00 |
Issuer name | TELEDYNE TECHNOLOGIES INCORPORATED |
Issuer type | corporate |
Maturity date | 2028-04-01 |
Name | TELEDYNE TECHNOLOGIES INCORPORATED 2.25% 2028 |
Rank | senior unsecured |
Ticker | TDY 2.25 04/01/28 |
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