Bond Data: US879360AD71 | TELEDYNE TECHNOLOGIES INCORPORATED 2.25% 2028
| Pricing | |
|---|---|
| Date | 2025-04-24 |
| Duration | 2.85 |
| Price | 93.03 |
| Yield to maturity | 4.88 |
| Reference | |
|---|---|
| Asset class | bond |
| Country | United States of America |
| Coupon | 2.250 |
| Currency | USD |
| FIGI | BBG00ZKWNC25 |
| Interest type | fixed rate |
| Callable | Yes |
| Outstanding | Yes |
| Puttable | No |
| ISIN | US879360AD71 |
| Issued amount | 700,000,000.00 |
| Issuer name | TELEDYNE TECHNOLOGIES INCORPORATED |
| Issuer type | corporate |
| Maturity date | 2028-04-01 |
| Name | TELEDYNE TECHNOLOGIES INCORPORATED 2.25% 2028 |
| Rank | senior unsecured |
| Ticker | TDY 2.25 04/01/28 |
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