Bond Data: US94419LAP67

WAYFAIR INC 3.25% 2027

Pricing
Date 2025-02-21
Duration
Price 109.07
Yield to maturity -0.27
Reference
Asset class bond
Country United States of America
Coupon 3.25
Currency USD
FIGI BBG019K2VZR1
Interest type fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN US94419LAP67
Issued amount 600,000,000.00
Issuer name WAYFAIR INC
Issuer type corporate
Maturity date 2027-09-15
Name WAYFAIR INC 3.25% 2027
Rank senior unsecured
Ticker W 3.25 09/15/27
Price
Yield to Maturity (%)
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