Bond Data: US94419LAP67

WAYFAIR INC 3.25% 2027

Pricing
date 2025-01-08
duration 2.57159
price 108.21
yield_to_maturity 0.18479
Reference
asset_class bond
country United States of America
coupon 3.25
currency USD
figi BBG019K2VZR1
interest_type fixed rate
is_callable true
is_outstanding true
is_puttable false
isin US94419LAP67
issued_amount 6.0e8
issuer_name WAYFAIR INC
issuer_type corporate
maturity_date 2027-09-15
name WAYFAIR INC 3.25% 2027
rank senior unsecured
ticker W 3.25 09/15/27
Price
Yield to Maturity (%)
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