Bond Data: USU57238AF18 | QUALCOMM INCORPORATED 1.65% 2032
Pricing | |
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Date | 2025-08-05 |
Duration | 6.38 |
Price | 83.44 |
Yield to maturity | 4.56 |
Reference | |
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Asset class | Bond |
Country | United States of America |
Coupon | 1.650 |
Currency | USD |
FIGI | BBG00WMMJH08 |
Interest type | Fixed rate |
Callable | Yes |
Outstanding | Yes |
Puttable | No |
ISIN | USU57238AF18 |
Issued amount | 1,245,206,000.00 |
Issuer name | QUALCOMM INCORPORATED |
Issuer type | Corporate |
Maturity date | 2032-05-20 |
Name | QUALCOMM INCORPORATED 1.65% 2032 |
Rank | Senior unsecured |
Ticker | QCOM 1.65 05/20/32 REGS |
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