Bond Data: USU88868AB71 | TMOBILE USA INC 4.375% 2040

Pricing
Date 2023-12-13
Duration 11.04
Price 77.59
Yield to maturity 6.75
Reference
Asset class Bond
Country United States of America
Coupon 4.375
Currency USD
FIGI BBG00SZSPBL3
Interest type Fixed rate
Callable Yes
Outstanding Yes
Puttable No
ISIN USU88868AB71
Issued amount 2,000,000,000.00
Issuer name TMOBILE USA INC
Issuer type Corporate
Maturity date 2040-04-15
Name TMOBILE USA INC 4.375% 2040
Rank Secured
Ticker TMUS 4.375 04/15/40 REGS
Price
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Yield to Maturity (%)
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