Bond Data: XS2377688093 | CHENGDU HITECH INVESTMENT GROUP 2.7% 2026
| Pricing | |
|---|---|
| Date | 2025-10-27 |
| Duration | 0.98 |
| Price | 97.28 |
| Yield to maturity | 5.61 |
| Reference | |
|---|---|
| Asset class | Bond |
| Country | China |
| Coupon | 2.700 |
| Currency | USD |
| FIGI | BBG0132X5MX7 |
| Interest type | Fixed rate |
| Callable | No |
| Outstanding | Yes |
| Puttable | No |
| ISIN | XS2377688093 |
| Issued amount | 300,000,000.00 |
| Issuer name | CHENGDU HITECH INVESTMENT GROUP |
| Issuer type | Corporate |
| Maturity date | 2026-10-28 |
| Name | CHENGDU HITECH INVESTMENT GROUP 2.7% 2026 |
| Rank | Senior unsecured |
| Ticker | CDHIIN 2.7 10/28/26 |
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